Microtronic exhibit at SMT Hybrid Packaging

8th April 2015

Microtronic AG

Jordan Mulcare

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Microtronic will display a range of products in Booth 7-101L at SMT Hybrid Packaging, scheduled to take place 5^th to 7^th May, 2015 at the Messe in Nuremberg, Germany. At the booth AIM will highlight specialty soldering materials in alloys of indium, tin, lead, bismuth, cadmium, gold and gallium for a wide range of joining applications.

These materials come in a variety of forms, including wire, foil & ribbon, seals, pastes, chemicals and compounds. AIM’s range of products includes solders for photonic packaging, solder fabrications, indium seals, fusible alloys, sputtering targets, solder test kits and more.

Also on display will be Akrometrix LLC’s CXP, the latest surface measurement equipment platform powered by Studio Software.The CXP addresses EMS and PCB market needs for affordable surface characterization of PCB local areas under reflow conditions. The capabilities of the CXP tool make it a cost-effective solution for EMS and PCB companies to apply the new IPC 9641 standard, concerning warpage measurement of PCB surface mount regions.

Another product highlighted at the show will be Microtronic’s LBT-210 automatic and PC-controlled solderability tester- a revolutionary system that meets today’s current industry challenges. The system offers the traditional solderability test methods with a solder bath or a globule and does support all relevant standards. Microtronic offers a test with substrate, soldepaste and component. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

Finally, stop by the booth to see the Sonix ECHO Ultrasonic Flaw Detector. The ECHO scanning acoustic microscope is a non-destructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.