LPKF shows laser application highlights at productronica

The presentation highlights will be three new ProtoLasers - specially designed for laser micro material processing in the development lab. The ProtoLaser S4 works with a green laser to yield a number of advantages for circuit board processing: faster PCB manufacturing, gentle substrate treatment and easy-to-use software optimised for this application. The ProtoLaser U4 will also make its debut at productronica. The new system measures the energy input at the material level, comes with a fast, high-resolution vision system and can process delicate substrates through additional energy stability in the low energy range.

The ProtoLaser R has been optimised for cold processing of thin films. This system utilises a picosecond laser source with extremely short laser pulses to enable processing without producing heat affected zones.

Another highlight of the LPKF presentation will be the 3D LDS technology. This technology is used to apply conductive metal structures to three-dimensional plastic bodies. The LPKF Fusion3D 1200 laser structurer features a fast rotary table with two nests. There is room for up to three laser processing heads operating simultaneously in the processing area. The demonstration system features the latest generation of processing heads. The heads can be designed for extreme speed (for up to 25% higher productivity) or high precision.

LPKF will not only introduce new products but also present new laser processes such as the automated, networked laser depaneling process integrated into the SMT line and large-stencil processing.