Infineon showcases solutions at TRUSTECH 2024

At booth G 035 in Pavilion 5.2, visitors can enter Infineon's futuristic green park, a city centre hub that demonstrates how the company is enabling the future of payment and identity. The products, demonstrations, and design tools presented at the trade show include environmentally friendly payment cards made from sustainable materials, biometric payment cards with flexible enrollment options, and various eID cards and passports with ultra-thin eDatapages in interactive use cases. The following solutions will be showcased:

SECORA Pay Green for up to 100 percent less plastic waste: SECORA Pay Green is the pioneer of a new generation of payment card technologies. The solution sets new standards in recyclability and combines Infineon's new environmentally friendly Coil-on-Module (eCoM) package, which contains the security controller and all software components, with an integrated contactless antenna to simplify the recycling of dual-interface payment cards. At the end of the card's service life, the complete eCoM package can be removed from the card and disposed of as electronic waste. The homogeneous card body can then be recycled as plastic, wood or paper, depending on the original material used.

SECORA Pay Bio for the next level of biometric payment cards: SECORA Pay Bio integrates Infineon's enhanced SLC39B System-on-Chip (SoC) Secure Element and the FPC1323 sensor from Fingerprint Cards AB into the Biometric Coil on Module (BCoM) package, utilising the benefits of inductive coupling technology. The solution uses the biometric credentials securely stored on the card as a second authentication factor, enabling convenient and secured contactless payment.

Infineon's eID-OS solution and packaging for ultra-thin eDatapages in passports: The eID-OS native government ID solution is based on the proven TEGRION SLC26 security controller. It comes with various applets that support all mainstream government applications such as ePassports, national electronic ID cards, electronic driving licenses and eHealthcare cards. eID-OS is available in the innovative CoM contactless package technology, allowing for ultra-thin electronic datapages in passports. This reduces polycarbonate material consumption and helps minimising carbon emissions, making it a more environmentally friendly option.

New SECORA ID solutions and applets to accelerate eID projects: SECORA ID is a ready-to-use Java Card solution optimised for electronic ID use cases. It accelerates time-to-market while enabling easy and efficient customisation to support local eID and multi-application systems. In combination with a dedicated tool, the SECORA ID platform also offers customers maximum freedom to develop their own customised applets.

FIDO authentication and security solutions redefine modern user authentication. In today's connected world where security is paramount, Infineon's ID key products offer a range of solutions for securing physical and digital assets. These include USB and USB/NFC token products featuring dual-chip SMD packages with integrated security controllers and USB and NFC interfaces certified to Common Criteria EAL 6+ level.

Meet the Infineon experts

At the Innovation Stage at TRUSTECH, visitors will have the opportunity to discuss the following topics with Infineon experts:

• “Next-level controller architectures for the security challenges of tomorrow”, on 3 December 2024 at 3:30 pm presented by Robert Bach, Director Product Marketing for Government ID.
• “Convenient, innovative and trusted biometric solutions: Make easy and scalable biometric payment front-of-wallet” on 4 December at 4:30 pm presented by Fang Lu-Ruhbach, Product Marketing for SECORA Pay Bio.
• “Innovation for more sustainable payment cards: Up to 100% reduction in plastic waste and shrink of carbon footprint with SECORA Pay Green” on 5 December 2024 at 12:30 pm presented by Ester Jimenez, Product Marketing for payment and transport applications.