Indium will participate in IEMT

Five of Indium's experts will present their pioneering research on Pb-free soldering solutions, which tackle key challenges in modern power electronics and advanced packaging applications.

Dr Dongkai Shangguan, Strategic Advisor at Indium Corporation, will deliver a keynote address titled 'Materials and Reliability for Advanced Packaging and Heterogeneous Integration'. This presentation will delve into the increasing complexity of interconnect reliability in advanced packaging, driven by the demand for high-performance, high-density applications, and the rise of heterogeneous integration.

Dean Payne, Product Manager for Semiconductors, will present on 'Making the Move from High-Pb Solder to Pb-Free for Die-Attach in Discrete Power Devices'. This session will examine the shift from traditional high-lead (Pb) solder to Pb-free alternatives in die attach applications for discrete power devices, highlighting Indium's innovations aimed at delivering sustainable Pb-free solutions for power discrete die attach.

Demi Yao, R&D Sintering Project Manager, will deliver a talk titled 'Pressure and Pressure-less Cu Sintering Paste Developed for Next-Generation Interconnection Material'. This presentation will showcase copper (Cu) sintering pastes designed for high-power applications, providing advantages such as low cost, high thermal and electrical conductivity, and the elimination of precious metal plating like gold or silver.

Assistant Product Manager for Power Electronics, Sunny Neoh, will give a poster presentation on 'Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Applications for Improved Thermomechanical Performance'. This session will explore advancements in Pb-free solder preform technology for substrate attachment in high-power electronics, focusing on the development of high-reliability alloys like SAC-In, Sn-Sb, and SAC-Sb, designed to enhance the durability of large-area solder joints under thermal cycling.

Research Chemist Mary Li Ma will also present a poster titled 'Voiding Control of Lead-Free Soldering at Quad-Flat No-Lead Package Components'. This presentation addresses the challenge of controlling voiding in thermal pads within quad-flat no-lead (QFN) packages, crucial for applications where size, weight, and thermal properties are key. The study introduces a low-voiding paste developed to improve QFN performance.