Indium to showcase semiconductor innovations at IMAPS

1st March 2024

Sheryl Miles

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Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

Indium Corporation’s proven SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance.

Indium Corporation’s SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s newest jetting solder paste, PicoShot NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems.

Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimised for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6 nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.