Indium to showcase power electronics products at NEPCON Japan

Indium Corporation will showcase the following among its featured products:

• Award-winning InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
• Indalloy301LT  for Preforms/InFORMS is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• SiPaste series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. The series of products helps avoid the void, reduce slumping, and demonstrates consistent printing performance.
• Heat-Spring, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals – with pure indium metal delivering 86W/mK in all planes.
• InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.