Indium experts will present at Electronics in Harsh Environments Conference

Vijay's presentation, titled "Electrification & Automotive Power Electronics – Innovative High-Reliability Solder Materials," will spotlight interconnect solder materials tailored to meet the increasingly stringent demands arising from heightened electrification in automotive and other power electronics sectors.

“Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth,” said Vijay. “Power module construction is also evolving. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.”

Leading the applications engineering team for clients across Europe, Africa, and the Middle East, Vijay specialises in automotive, industrial, and RF applications encompassing PCBA and power electronics. He focuses on employing various material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.

With over two decades of experience in electronics assembly and a master’s degree in industrial engineering with a specialisation in electronics packaging and manufacturing from the State University of New York, Binghamton, Vijay brings extensive expertise to his role. He holds certifications as a Certified SMT Process Engineer and a Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. Active in several industry organisations like IMAPS and SMTA, Vijay has presented at numerous industry forums and conferences globally.

Dr. Ronald Lasky will conduct a workshop and presentation at the conference:

1. Testing and Evaluation of Solders for Reliability in Harsh Environments
2. Thermal Interface Materials (TIMs): Their Status and Applications in 2024

The Testing and Evaluation workshop, designed for intermediate-level participants, will delve into all aspects of selecting and implementing solder paste for achieving high reliability and yields in challenging environments.

Dr. Lasky, a senior technologist at Indium Corporation and a professor of engineering at Dartmouth College, brings over 30 years of experience in electronics and optoelectronics packaging at renowned companies like IBM, Universal Instruments, and Cookson Electronics. An accomplished author and instructor, Dr. Lasky has authored several books and technical papers and has contributed significantly to advancing science, electronics, and optoelectronics. Holding numerous patent disclosures and being a developer of various SMT processing software products, Dr. Lasky's contributions have been recognised with prestigious awards, including the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 and the Founder’s Award in 2003.