Indium expert to discuss Pb-free solder for power applications

Payne’s presentation, scheduled for the 9^th May 2024, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.

High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials.

Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.

“The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability,” said Payne. “With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.”

Payne is responsible for driving the profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication.

Payne holds multiple certifications from the University of Wales and Coleg Gwent in the UK, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.