Events News
Indium Corporation showcases AI-ready materials in China
26th March 2025
Sheryl Miles
Indium Corporation will present its range of thermal interface materials (TIMs) designed for AI applications at Productronica China, taking place from 26th-28th March in Shanghai.
Its GalliTHERM portfolio includes gallium-based liquid metal solutions developed from more than 60 years of experience in manufacturing gallium-based materials. These liquid metal TIMs are designed for both TIM¹ and TIM² applications and provide key benefits, including:
- High thermal conductivity compared to polymers
- High purity for improved surface wetting
- No need for soldering or surface metallisation
Liquid metal TIMs can help improve heat dissipation in power-dense AI hardware by maintaining effective thermal contact between components.
Indium Corporation’s Solder Thermal Interface Materials are designed to manage heat in high-performance devices. With a bulk thermal conductivity of 86W/m-K, indium-based TIMs are less sensitive to bond line thickness and coplanarity issues than polymer alternatives. Their ductility also allows them to accommodate differential thermal expansion, reducing stress at the interface. This makes solder-based TIMs suitable for TIM1 or TIM1.5 applications, particularly where die or substrate warpage and CTE mismatch are present.
The company’s Heat-Spring solutions offer a non-reflow metal TIM2 option that remains stable under varying conditions. In liquid immersion cooling systems, Heat-Spring is compatible with major immersion fluids and does not dissolve in Single-Phase or Two-Phase cooling liquids. These indium-based TIMs maintain consistent thermal conductivity (86W/m·K in all directions), helping to prevent performance issues associated with non-metal alternatives.
Additionally, because they remain in a solid metal state, Heat-Spring TIMs help mitigate common concerns such as pump-out and bake-out. Indium Corporation also offers a reclaim and recycling programme for its TIMs, supporting sustainability efforts in advanced electronics manufacturing.
