Focus on automotive power electronics

“Hardly any other area is influenced as much by the energy transition as the automotive industry,” said Dr. Johann Weinhändler, Regional Head of ASMPT Semiconductor Solutions Europe and Managing Director of ASMPT AMICRA in Regensburg. “The vehicle of the future will be fully electric and is basically a high-performance computer on wheels. This requires a new generation of efficient and reliable power electronics – i.e., power modules. To produce these, we offer semiconductor manufacturers innovative high-performance solutions from a single source.”

The spectrum of technology platforms offered by ASMPT covers the entire production cycle of modern power electronics, ranging from wafer separation, printing, and curing to die and module tracking, silver-sintering, and finally encapsulation. Four machines that are particularly relevant for the demanding applications in automotive power electronics will be highlighted at the PCIM event:

Gentle separation with ALSI LASER1205

The ALSI LASER1205 platform for wafer grooving and separation processes even highly sensitive dies with precision thanks to its integrated V-DOE technology which greatly reduces the area affected by heat. The machine’s ergonomic design and user-friendly touchscreen interface enable intuitive operation and speed up training.

Ag/Cu sintering with POWER VECTOR

This innovative die tacking solution for Ag/Cu sintering features a heated thermo-compression bonding head and processes various silver sintering materials, including silver film stamping and the automated handling of silver film for mass production. The heated workpiece holder has a generously sized platen measuring 140 x 340mm.

Silver sintering with SilverSAM

Designed for high-volume production, the SilverSAM silver sintering platform features an oxidation-free, copper-friendly operating environment. It processes various substrate formats and produces highly reliable connections that are clearly superior to classic soldered joints in terms of mechanical and thermal resilience and electrical conductivity.

Flexible encapsulation with 3GeP

The 3GeP moulding platform encapsulates multiple power modules measuring in total up to100 x 300mm per work piece carrier fitting two work piece carrier per mould shot. Depending on the production requirements, the machine can be equipped with one to four presses and be integrated seamlessly into existing production lines – both in front-of-line (FOL) and post-encapsulation (PEP) areas with full inline capability.