ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at its booth during the OFC 2025 trade show, from 1-3 April in California.
“Both the OFC and ASMPT celebrate their 50th anniversaries this year,” said Jean-Marc Peallat, PhD, Regional Head ASMPT Semiconductor Solutions Americas and General Manager ASMPT AEi in Billerica, Massachusetts, US. “We have been exhibiting at this event, the world’s most important congress and exhibition for optical communication technology, IT and software, for many years and will once again present forward-looking solutions this year.”
One key feature of the ASMPT booth will be the AMICRA NANO high-precision die and flip-chip bonder, which was specially developed for the production of innovative communication components that feature optical and electronic components co-packaged in a single housing.
Offering exceptional process stability, a placement accuracy of ±0.2 μm @ 3 σ, bonding forces ranging from of 0.1 to 20 N and a throughput rating of up to 400 components per hour, the AMICRA NANO is setting new standards. The machine employs an innovative hybrid bonding technology that does not require any solder or glue but uses atomic diffusion to create stable mechanical and electrical connections.
Hybrid bonding will soon be essential in applications that require maximum performance in the smallest of spaces – for example, in high-performance and quantum computers, AI systems, IoT devices, or autonomous vehicles.
The AMICRA NOVA Pro will be another highlight. As one of the most advanced die bonding systems available, it places dies ranging from 0.1 to 25 millimetres in size with a maximum accuracy of ±1 μm @ 3 σ at speeds of up to 1,000 units per hour. The AMICRA NOVA Pro achieves this performance even in flip-chip mode. With its very generous substrate area of 550 × 600mm, the NOVA Pro is also aimed at the die-bonding market in advanced packaging applications.
Visitors to the company's booth will also be able to find out more about the MEGA multi-chip bonder, a state-of-the-art platform that integrates multiple chips in a single housing with the unequaled precision of ±2 μm. With an automatic bond tool changer, up to ten bond tool buffers and five ejector tools, the MEGA system processes chips ranging in size from 0.15 × 0.15 mm to 10 × 10mm and substrates measuring up to 130 × 300mm. This means that the machine can be used in a wide range of manufacturing processes for products such as optical transceivers, photonics and sensors, as well as for lighting technology in the automotive sector.
