Alphawave will showcase AI and connectivity at ECOC

ECOC, celebrating its 50th anniversary, is Europe's foremost event for optical communications, bringing together experts from academia, research, and industry.

At its exhibition booth (#B115), Alphawave Semi will present live demonstrations of its cutting-edge connectivity IP solutions, alongside collaborations with key partners. These include:

1. The first live demonstration of its 24Gb/s UCIe D2D subsystem in TSMC's 3nm CoWoS Advanced Packaging platform.
2. A showcase of its 128 GT/s Optical PCIe demonstration with Innolight LPO.
3. A 128 GT/s Electrical PCIe demonstration with Samtec High Density Interconnect, highlighting high-performance SerDes with high-density connectors designed for GPU-to-GPU connections, displayed at the Samtec stand (#D2).
4. An energy-efficient accelerator card featuring I/O chiplet, compute chiplet, UCIe, and HBM subsystems, developed in collaboration with Lessengers and TE Future Connectivity.
5. Participation in the Optical Internetworking Forum (OIF) with demonstrations of the interoperability of its connectivity IP, including chiplet interconnects between multiple dies. This will be run in collaboration with TE and Lessenger, alongside 112G SerDes and PCIe 7.0 inter-optical loopbacks at the OIF stand (#B83).

In addition, Alphawave Semi’s CTO, Dr. Tony Chan Carusone, will deliver a workshop as part of the conference’s 'Bottlenecks & Trends for AI, Cloud, and HPC' series. The session, scheduled for 5:30 p.m. on 22nd September, will focus on I/O solutions for AI clusters, addressing issues related to scaling AI clusters, multi-chip package scaling, redundancy, and thermal management. Dr. Carusone will also explore electrical and optical I/O for pluggable and near-package/co-packaged optics, offering insights into advanced AI hardware architectures.