Events News
More than 73,000 visitors attended electronica 2014
In the year of electronica's 50th brithday, the number of international visitors increased from 47 to 50%. The trade fair, which is the world's largest event for the electronics industry, revealed that the future is connected – from wearables and cars to entire towns and cities.
iLCDs enhanced with capacitive touch screens
electronica 2014 was the launch pad for demmel products latest iLCD models with capacitive touch screens. The 5.0in, 5.7in, and 7in iLCDs are now available with projected capacitive touch technology making them robust for operation outdoors and where vandal-proof designs are necessary.
electronica plays host to TI's Innovation Challenge
Today, at electronica (14th November), the results of the Texas Instruments Innovation Challenge - Europe Analog Design Contest 2014 were announced. The presentation also featured speeches from previous TIIC winner, Hans De Clercq, TI representative Steve Lyle, and co-sponsor Mouser Electronics' Mark Burr-Lonnon.
Panasonic Presents Latest Smart Home and Automotive Applications at Electronica 14
Panasonic Automotive & Industrial Systems Europe (PAISEU) which combines the decades of experience from Panasonic Automotive Systems Europe, Sanyo Components Europe, Panasonic Industrial Devices Sales Europe and Panasonic Electric Works, will exhibit for the first time, as a newly founded consolidated company at Electronica 2014 – Munich, Germany, November 11-14.
Connectivity & sensor technologies at electronica
TE Connectivity is unveiling its highly engineered, cutting edge connectivity and sensor technologies at electronica, in B3.225. TE will highlight its portfolio of intelligent, efficient and high-performing solutions in use by customers across several industries, including automotive, industrial & commercial transportation, aerospace, defence and consumer applications.
DrMOS power stages meet design challenges in POL applications
Vishay Intertechnology arrived at the electronica exhibition in Munich with a new family of VRPower integrated DrMOS power stage solutions in three PowerPAK package sizes to meet the various design challenges in high-power and high-performance multiphase POL applications. The SiC789 and the SiC788 are offered in the MLP66-40L with an Intel 4.0 DrMOS Standard (6 mm by 6 mm) footprint.
Power connectors resist extreme temperatures
In response to demands from customers requiring a resilient power connector, Harwin, has launched a family of high density power connectors that can handle currents up to 10A and withstand temperatures between -65degrees C and 175 degrees C. Based on a 3mm pitch, the M300 connectors are designed for rugged environments and withstand twice the number of operations as older generation products.
Cambridge Wireless announces speaker line-up for Technology Conference 2015
A strong line-up of speakers has been announced for the first Cambridge Wireless Technology Engineering Conference (CW TEC) in London on the 24th March 2015.
SMART Group’s One-Day 3D AOI Seminar at MTC to Focus on Myth Busting & New Technology
SMART Group announces that it will present “Advances in AOI Technology: 3D AOI, Exploding the Myths and Looking at New Technology,” a full-day event on Tuesday, 2nd December 2014 from 0930 to 1600 at the Manufacturing Technology Centre (MTC) in Anstey Park, Coventry.
Microsemi to Present “Security for the Internet of Things: Challenges and Solutions,” During Electronica 2014’s Embedded Forum and Participate as a Panel Member as Part of the Event’s Security Forum
WHAT: Microsemi Corporation will participate in Electronica 2014’s Embedded Forum with a presentation titled, “Security for the Internet of Things (IoT): Challenges and Solutions” that outlines using advanced security features of its SmartFusion2 SoC FPGAs and IGLOO2 FPGAs. Microsemi will also participate as a panel member at Electronica’s Security Forum.