Events News
Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT
Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia. Ken Chiavone, Vice President of Engineering, will present “Analyzing Package-on-Package (PoP) Reflow Assembly Interfaces with Interconnect Gap Analysis.”
'Secure Connections for a Smarter World'
NXP will present its high performance mixed signal solutions to enable 'Secure Connections for a Smarter World'. Key demonstrations at the show will include Cabrio Car, an automotive showcase of future of the connected car including use cases such as RFID number plates and e-driver licenses.
Beta LAYOUT presents 3D innovations
Beta LAYOUT will exhibit solutions for automatic 3D data conversion and 3D-MID (Moulded Interconnect Device) prototyping. A comprehensive 3D package, 'brd - to - 3D' enables customers to create the complete virtual circuit board package directly from an EAGLE *.brd file.
Electronic Specifier to host round-table on security at electronica 2014
Electronic Specifier will be hosting an Industry Round-Table at electronica 2014, Messe Munich, Germany, 11th to 14th November. Organised by Electronic Specifier at the invitation of the organisers, the Round-Table will take place on Wednesday 12th in the electronica Forum Area in Hall A3. There will be two 90-minute sessions taking place between 10:00 and 13:00, comprising six industry experts in each session.
Power supply solutions showcased at ITC
Visitors to the International Test Conference in Seattle (Oct 21-23) will find a comprehensive line of highly efficient power supply solutions for test & measurement applications on display from SL Power Electronics. During the three-day show, SL Power executives will discuss with attendees the company’s specifically designed power solutions for electronic test, communications test and automated test equipment.
Let your voice be heard at VOICE
Advantest is once again offering engineers and designers the chance to participate at its VOICE 2015 annual Advantest Developer Conference. The test equipment supplier has issued an international call for papers focusing on innovative test solutions for system-on-chip (SoC) and memory semiconductor devices and handler solutions.
Automotive chip resistor takes trip to electronica
Thin film automotive grade chip resistors that meet the market demand for stability, high precision and accuracy for electric circuit design will draw interest to Rutronik’s stand at electronica. The AT series from Yageo is compliant to AEC-Q200 and combines superior anti-sulfur capability with a robust product design and a high pulse load performance. To eliminate early failures before final testing at taping/sealing, it provides quality a...
AC-DC power supply switches on for electronica
Farnell element14 will pack a power punch at electronica displaying what is claimed to be the industry’s smallest encapsulated 60 Watt AC-DC power supply, the ECE60 Series from XP Power. The ECE60 series of compact encapsulated AC-DC power modules are available in both PCB & chassis mount versions offering exceptional power density of >10W/in3.
electronica 2014: Six-in-one scope rolls into Munich
The six-in-one MDO3000 Series oscilloscope will take centre stage on the Tektronix stand at electronica. Not just a scope it also integrates a spectrum analyser, logic analyser, protocol analyser, arbitrary function generator and digital voltmeter. Its presence will emphasise how it enables engineers to clear their bench of multiple instruments.
Pentair present innovative subracks, enclosures & cabinets
Pentair will present the latest products from its Schroff brand with the Interscale case platform taking centre stage. Other product highlights in B1.243 will include MicroTCA and AdvancedTCA systems, subracks, electronics cabinets, the online Interscale M configurator tool and the Schroff Park2Power charging system.