Events News

AGT International has announced its participation in one of the European Union’s Horizon 2020 Lighthouse Projects. AGT will be working with the German city of Cologne on a five year project to demonstrate how European cities can grow and become ‘smarter’ through technology.

To support future engineers, RS Components donated 50 Raspberry Pi devices to CoderDojo’s Coolest Projects, an event to find Ireland’s brightest young coders. The event allowed members of CoderDojo, community-based programming clubs supported by the Coderdojo Foundation, to showcase the projects they have created. RS also offered a prize of 250 euros worth of RS products for use in future projects.

Culminating a year and a half of intensive preparation by teams from around the world, nearly two dozen robots strove to prove their full-metal mettle in simulated disaster zones during the two-day DARPA Robotics Challenge (DRC) Finals, held on the 5th and 6th June at the Fairplex in Pomona, California.

Innorobo 2015, the only event 100% dedicated to robotics, is scheduled to take place from 1st to 3rd July at Cité Internationale in Lyon, France.

  At SEMICON West 2015, which takes place from 14th to 16th July at the Moscone Center in San Francisco, Nordson DAGE will exhibit in booth 5744. Here, the company will present the 4800 wafer level Bondtester for the first time in North America.

The Constumat event, which was hosted by the Institute for Advanced Architecture of Catalonia and took place in Barcelona, provided the World’s Advanced Saving Project (WASP) with the opportunity to experiment with its BigDelta 3D printer, designed to create ‘zero-mile’ homes.

  Synflex will use CWIEME Shanghai to launch its SYNtherm multi-layer flexible insulation range, designed to meet the price, application and delivery requirements of the Asian market.

  Exhibiting at PCIM Asia from the 24th-26th of June, GaN Systems will be showcasing the latest addition to its range of GaN high power transistors for the first time in China, at booth 4D18. The company is also demonstrating production models of real customer applications using its devices.

Edinburgh Research and Innovation, the commercialisation arm of The University of Edinburgh, has announced a new AIMday (The Academic Industry Meeting) for companies looking to find an innovative solution to challenges around sensors and signal processing.

Exploration of new energy carriers and interim storage of sustainable energies are two big challenges of the Energiewende, the transformation of the energy system. At its ACHEMA booth, KIT will present the latest processes for this purpose. ACHEMA is scheduled to take place from 15th to 19th June in Frankfurt; KIT will be located at booth 9.2 D67.