Awards

Indium recognised for solder paste and flux-cored wire

7th April 2025
Caitlin Gittins
0

Indium recently earned two CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for its high-reliability alloy used for solder paste, Durafuse HR, and its high-reliability, halide and halogen-free flux-cored wire, CW-807RS.

The NPI Awards recognise leading new products for electronics assembly in the last 12 months. An independent panel of practicing engineers selects honourees based on a variety of criteria, including creativity and innovation, design, and performance. With an extended history of NPI Awards highlighting its commitment to innovation, Indium is proud to receive two more honours in 2025, further strengthening its position as a leader in electronics assembly materials.

“Our belief that materials science can change the world is exemplified by every one of our products,” said Ross Berntson, President and CEO, Indium. “CW-807RS delivers unmatched soldering speed, spatter control, and overall cleanliness, while Durafuse HR is a breakthrough alloy that improves thermal cycling performance and reduces voiding, providing game-changing solutions for high-reliability applications. We’re excited to offer these innovations to make a lasting impact on our customers and the industry.”

Durafuse HR is a high-reliability solder alloy developed from the company’s Durafuse mixed-alloy technology. Engineered to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, Durafuse HR is designed specifically for the rigorous demands of automotive electronics and other high-reliability applications. It is ideal for manufacturers transitioning from SAC305, requiring only minimal process adjustments for easy implementation.

Among its key features, Durafuse HR offers:

  • Exceptional thermal cycling reliability, withstanding 3,000+ cycles at -40°C–125°C
  • Reduced bottom-terminated component (BTC) voiding, even without vacuum reflow
  • Superior shear strength for increased durability and reduced solder joint cracking
  • Compatibility with most SAC305 reflow profiles and common PCB surface finishes (ImSn, OSP, ENIG) while allowing for fine-tuning to meet precise process requirements.
  • Optimised yield rates and reliability, reducing defects, rework, and overall production costs

CW-807RS is a next-generation high-reliability, halide, and halogen-free flux-cored wire designed to improve wetting speeds and cycle times in electronics assembly and robotic soldering applications. Built upon the proven performance of the CW-807 and CW-818 formulas, CW-807RS features fast wetting and enhanced spatter control technology for a cleaner, more efficient soldering process.

Key features:

  • Faster wetting speeds for improved cycle times
  • Minimal spattering and clear to light-coloured residue for an aesthetically clean finish
  • Excellent solderability in manual and robotic applications requiring an 'L0' IPC classification
  • Versatility across a wide range of alloys and diameters to meet diverse assembly needs
  • Reliability, passing stringent test requirements with no dendritic growth or visible corrosion

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