Analysis
New X-Plane Technology from Nordson DAGE Earns a 2012 Innovation Award during NEPCON China
Nordson DAGE announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane Analysis – Sub Micron X-Ray Inspection System Option. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China.
PhilX-Plane is a revolutionary option for Nordson DAGE’s range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane technology is quick, simple and easy-to-use.
The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.