Verigy Receives SEMI's First Advanced Testing Innovation Award

Verigy is being recognized by its industry colleagues for providing advanced semiconductor-testing capabilities that enable cost-effective production of today's and tomorrow's semiconductor devices, said Stanley T. Myers, president and CEO of SEMI. Such innovative test technologies form the foundation of the entire electronics ecosystem.

Verigy's pioneering work in semiconductor test equipment includes developing the industry's only scalable platforms with the flexibility to test a wide range of semiconductor devices in parallel, said Pascal Rondé, vice president of sales, service and support for Verigy. Our innovative drive is firmly fixed on helping our customers to achieve higher productivity, get their newest products to market faster, and become more cost competitive.

Verigy won the award in a vote by industry members serving on SEMI's Packaging & Test Committee in Taiwan, chaired by Dr. Ho-Ming Tong, general manager and chief R&D officer at ASE Group. Taiwan continues to grow its importance in the semiconductor supply chain as leading semiconductor foundries there perform the full spectrum of wafer fabrication and testing services.

Capable of handling a variety of frequency ranges, pin counts and device types, Verigy's test systems help customers to shorten their time to market and lower their overall cost of test. The company's landmark advances include ASIC-based tester-per-pin and tester-per-site architectures, which enable independent testing of each device pin for highly parallel and efficient testing. In addition, Verigy's proprietary tester-on-board(tm) architecture simplifies tester hardware, configuration and system support for more cost-effective performance.

To address the next generation of testing needs, Verigy continues to develop innovative solutions for direct-probing of radio-frequency (RF) communication devices and 3D IC testing. Just introduced in June, the V93000 Direct-Probe(tm) solution reduces the length and number of signal-path transitions between the tester and probe card, bringing the industry's highest test performance to wireless, wafer-level chip scale package, MPU and GPU devices at wafer probe. In addition, Verigy has been actively developing 3D IC testing technologies since 2007 and is a member of the 3D IC Special Interest Group, which is jointly hosted by SIPO, ITRI, TSIA and SEMI Taiwan.