Analysis

TranSwitch Integrates Xtensa Processors

9th June 2009
ES Admin
0
Tensilica has announced that TranSwitch Corporation has integrated two Xtensa customizable Dataplane Processor Units (DPUs) into its recently introduced Atlanta 2000 gigabit-rate communications processor product family. Atlanta 2000 offers robust gateway routing, security and VoIP capabilities with unmatched performance and power efficiency, enabling customers to develop the next generation of high-performance green networking products and services for residential, small office/home office, and small-to-medium-sized business CPE (customer premise equipment) applications.
Atlanta 2000 highlights the versatility of Tensilica's DPUs. Although Tensilica is best known for its dominant position for the SOC (system-on-chip) dataplane applications, the Atlanta 2000 is an example of how Tensilica's customizable DPUs can also be utilized as cores for the most demanding embedded CPU applications. Tensilica's FLIX (Flexible Length Instruction eXtensions) technology enabled TranSwitch to integrate two 3-issue VLIW (very long instruction word) CPUs, each capable of issuing three independent operations per cycle at a 400 MHz clock rate equivalent to a 1.2 GHz conventional scalar CPU.

Atlanta 2000 is the latest and most advanced addition to our field-proven communications processor family, stated William McDonald, director of marketing at TranSwitch. By leveraging the multi-issue, VLIW capability of Tensilica's processors, we have realized a best-in-class communications processor with plenty of headroom to spare for the most demanding secure broadband gateway, SSL/TLS and IPSec VPN acceleration, and micro-PBX applications.

Atlanta 2000 is evidence that semiconductor and systems companies can achieve best-in-class performance at the lowest power through rapid and automated processor core customization, stated Steve Roddy, Tensilica's vice president of marketing and business development.

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier