Thermal management software extends from component to system level

Kaveh Azar, President and CEO of ATS, commented: “We have decades of experience with a broad base of commercially available CFD tools. For electronics thermal management analyses, 6SigmaET showed excellent agreement with our empirical and analytical modelling. We were equally impressed with its ease of use and short learning curve. Our engineering team was able to apply the tool to different levels of simulation extending from component to system level modelling. The speed of convergence and ease of use of 6SigmaET, have made it the first CFD software to use.

“We always want to be working with the best breed of tools to deliver the innovative, high-quality and cost-effective thermal management and packaging solutions our customers expect. As a result, this addition is good news for our customers,” Azar continued. “The rich features of the 6SigmaET thermal simulation package not only enable us to do more when it comes to simulation, but also allows us to further deliver the solution to our clients in a shorter time interval. It is my highest compliment to 6SigmaET development team for putting together such a robust and effective software.”

Akhil Docca, Corporate Marketing & Product Strategy Manager at Future Facilities, said: “For a number of years we have focused on putting usability, accuracy and rapid solve times at the heart of our tools to tackle the real thermal simulation issues currently facing the electronics industry. As such, a company of the stature of ATS, who is known for its innovation and best-in-class thermal management products, to add 6SigmaET as their first goto CFD tool while having a library of CFD tools, is a strong endorsement and accolade of 6SigmaET capabilities."