It might still be unusually difficult to get our hands on advanced semiconductor technology, but that hasn’t halted the march of progress in R&D labs across the world. The explosive demand for hardware of all kinds in the past two years has encouraged electronics engineers and designers to continue innovating despite the dearth of semiconductors worldwide. Tom Gregory, 6SigmaET Product Manager, 6SigmaET, Future Facilities discusses.

6SigmaET by Future Facilities launched its latest software version, Release 16, which introduces an array of new and improved features and functionality, including Enhanced View Photorealistic Models, faster Joule Heating, faster PCB Import, optimized 1D Flow Network, and 6SigmaCommander AI Automation. 

The market for wearable technology is entering a new phase. There has been a marked increase in popularity over the last few years, and the sector is growing at a rapid rate. As a result, forecasts from industry insiders and analysts predict that the market will be worth an estimated £34bn by 2020. Tom Gregory, Product Manager at 6SigmaET, explains further.

Advanced Thermal Solutions (ATS) has purchased multiple seats of 6SigmaET. The software will be used for simulations for different problem domains in thermal management of electronics.

Tom Gregory of Future Facilities explains how thermal simulation can reduce electronic product and system development and deployment costs. As he does so, he reveals how the integration of greater intelligence and automation into thermal modelling tools is delivering real benefits to a growing number of engineers.

Thermal performance is crucial in electronics designs and getting it wrong can mean a redesign or even a product recall that costs an awful lot of money and damage to reputation. A solution which heads off these problems has been enhanced in Release 9 of 6Sigma ET, a powerful, intuitive and easy-to-learn thermal simulation tool for use by designers of electronic components and products.