Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012

While I'm excited about hitting this important milestone, I'm even more excited about how bright our future looks, stated Jack Guedj, Tensilica's president and CEO. We reached this milestone with virtually no unit shipments in LTE, where we have significant design wins that have yet to reach production.
The growth in unit shipments is a direct result of Tensilica's investments in standard cores for the high-volume mobile wireless and home entertainment markets combined with high-volume custom designs in the PC and video/imaging markets. DPUs from Tensilica combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. They are used for the signal processing-intensive tasks such as audio, video, and communications in SOC (system-on-chip) designs.
Tensilica is at a point where the company could really take off, stated Will Strauss, president of Forward Concepts and leading DSP analyst. It quickly jumped to a formidable position in baseband DSP IP cores for LTE and has the leading audio DSP core, and their customers really appreciate the ability to customize the cores for their exact applications.
I want to thank our customers for their broad adoption of Tensilica products as well as all of the Tensilica employees, who have invested their hearts and minds into creating our leadership products and providing stellar support to our customers, stated Guedj.