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Tensilica And Huawei Expand Strategic Relationship For Next-Generation Products

26th February 2013

Tensilica

ES Admin

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Tensilica reveal that it has strengthened its strategic relationship with Huawei. HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s DPUs, including Tensilica’s Xtensa customizable processor technology, HiFi DSPs for audio and voice processing in smartphones and set-top boxes, and ConnX Baseband Engines for LTE base stations, handsets, and other network infrastructure and customer premise equipment.

“For more than four years, we have worked very closely with Tensilica on a number of projects,” stated Teresa He, vice president of HiSilicon. “We have found that Tensilica’s DPUs can help us differentiate our products and achieve competitive advantages in terms of power, performance, and area. Tensilica cores have operated as expected and their support has been superb, enabling us to significantly speed up our development time. We are very pleased to strengthen our relationship with this agreement.”

“HiSilicon has seen the value of our standard IP cores and core customization technology, which allows them to get the optimal mix of best-in-class power/performance/area and time-to-market, all backed up by our single tool set,” stated Jack Guedj, Tensilica’s president and CEO. “We are pleased to continue our long-lasting, close working relationship with HiSilicon.”