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Tensilica Demonstrates Success in Audio/Video and Broadband Communications at CES 2010

6th January 2010

Tensilica

ES Admin

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A host of products based on Tensilica's dataplane processors will be demonstrated at this year's Consumer Electronics Show, January 7-10 in Las Vegas. These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including Blu-ray Disc players, Bluetooth-enabled devices, LCD TVs, cellular phones, WiFi- and W-USB-enabled notebook computers, wireless HDMI, handheld games, and inkjet and laser printers. Tensilica will showcase its leading-edge audio, video and baseband communication IP cores, including the popular HiFi 2 Audio Engine running on the Android platform in collaboration with MIPS Technologies, in the South Hall of the Las Vegas Convention Center, suite South 4 35567MP. To schedule an appointment to see the demo, please contact paula@tensilica.com.

Over 150 companies worldwide have licensed Tensilica's DPUs. The high-volume home entertainment market is driving the proliferation of Tensilica DPUs for multimedia and broadband communications. The list of exhibitors at CES that either license or use silicon that includes Tensilica's DPUs includes: AMD, Atheros, Audience, Belkin, Broadcom, Cisco, D-Link Systems, Fujitsu, HP, iBiquity Digital, Intel, Jensen, JVC, Kenwood, Lenovo, LG Electronics, Marvell, Mitsubishi, Motorola, NEC Electronics, NVIDIA, Olympus, Panasonic, Pioneer, Samsung, Sanyo, SiBeam, Sony, Toshiba, Visio and Yamaha.

CES 2010 will highlight dozens of products utilizing Tensilica's HiFi Audio Engine, the industry's most widely licensed audio DSP core, Tensilica's VDO video processors and Tensilica's ConnX Baseband DSPs, stated Steve Roddy, Tensilica's vice president of marketing and business development. At CES in Las Vegas we will be previewing our newest HiFi Audio DSP that can help designers today create the innovative new silicon to power the showcase products of CES 2011.