Swiss Quality SMD Assembly Shown At Productronica India

Essemtec's promoted solution consist of a SP150 high accuracy solder paste printer and a RO400-FC full convection reflow oven. These two machines are especially designed to meet the requirements of a highly versatile production with many product changeovers and small to medium batch sizes.

The SP150 is a semi-automatic system with integrated stencil cleaning, controlled printing process and digital vision system. This affordable machine can reproducibly print finest structures even in larger series. Due to the space saving front drawer the SP150 fits into every production.

The vision system of the SP150 is easy and save: two digital cameras look through a stencil opening onto the substrate. The printer automatically recognizes if the substrate is misaligned. By integrated position encoders the software can instruct the operator exactly how to correct the alignment. The SP150 continuously controls the result. The print cycle is released only if the alignment is perfect.

Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. The RO400FC uses full convection only to heat PCBs homogeneously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the RO400FC suitable for lead free solders as well.

Zone temperatures – three preheat and one peak – are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.
The universal mesh belt or the precise chain conveyor transports single or double-sided boards up to 400 mm (15.7“) width.