Saline Lectronics now offers in-house wire bonding

Due to size constraints or cost limitations, certain electronic products specify wire bonding requirements as this process is one of the most flexible interconnect technologies available. In response to this increasing demand, Saline Lectronics has purchased the K&S manual wedge bonder to perform wire bonding assembly in-house. This will allow Lectronics to support both wedge bonding and ball bonding.

Scott Sober, Vice President of Continuous Improvements, Saline Lectronics, commented: “Since we work very closely with our customers during the design phase, we have seen a trend to reduce overall cost and package size of products while simultaneously increasing flexibility. In response to this trend, we decided to add wire bonding capabilities to our processes, which also will open the door to many chip-on-board applications.”

Lectronics’ wire bonding capabilities are suited for chip-on-board assembly, hybrid/multi-chip modules, microwave products and optoelectronic parts. The company is able to support both aluminium and gold wire, with a 3mm wire maximum limitation. Additionally, Lectronics can utilise ribbon with a maximum size of 1x10mm.

The K&S 4500 series bonder offers semi-automatic and manual operation modes, individual bond parameter control and capacity for a wide range of wire diameters. This enables ease-of-use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.

Lectronics plans to add even more services to its micro-assembly work area including die attachment, encapsulation and micro-assembly dicing.