Rogers to Show Laminate/Prepreg System Solution at Electronics Midwest 2010

Rogers’ new RO4360 thermoset laminate and RO4460 thermoset prepreg system offers the lowest total cost solution for fabricators of high-frequency, multilayer circuits seeking to reduce circuit board size. The high dielectric constant of 6.15 for both materials allows designers to create circuits with dimensions that are as much as 30% smaller than lower dielectric constant materials. Rogers RO4360 laminate features low dielectric loss of 0.003 at 2.5 GHz, a high thermal conductivity of 0.8 W/m-k, and is compatible with hybrid designs. This system is ideal for miniaturizing many high-frequency circuits, including amplifiers and filters.

Rogers Theta materials are ideal for high-speed digital applications requiring environmentally friendly, lead-free processing. These halogen-free materials feature a dielectric constant of 3.8 at 1 GHz and low loss, with a dissipation factor of 0.008 at 1 GHz. They exhibit a high glass transition temperature (Tg) of 180°C compatible with RoHS-compliant processing, and low z-axis coefficient of thermal expansion (CTE) for reliable plated-through-hole (PTH) performance in multilayer designs.