At the upcoming Laser World of Photonics Fair to be held 26th to 29th June at Messe München, Rogers's Power Electronics Solutions (PES) group will be showcasing its curamik cooling solutions. The bi-annual Laser World of Photonics is the only trade fair that combines photonics research and industry under one roof. With representatives from more than 70 countries attending, the event is held in conjunction with the World of Pho...

At The Battery Show 2016, Rogers Corporation’s Power Electronics Solutions (PES) group will highlight samples of its power-distribution and thermal-management solutions. These compact, light-weight solutions are of particular interest to designers of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs) in pursuit of increased driving ranges.

Rogers announced today that it is implementing further actions as part of its cost improvement initiatives. These actions are expected to provide substantial cost savings starting in the third quarter of 2013, building to a total annualized net cost savings of approximately $12 million by the first quarter of 2014. These actions include the following:

Rogers Corporation announces they will highlight several of its high-quality printed circuit board materials at the upcoming IPC APEX EXPO Conference & Exhibition. With more than 400 exhibiting companies expected at the San Diego Convention Center February 19-21, 2013, the IPC APEX EXPO which includes a highly technical conference on new research and developments is one of the industry’s leading events for PCB designers.

Rogers Corporation will be displaying several examples of its high quality printed circuit board (PCB) materials at the upcoming DesignCon 2013 Expo. This event is scheduled for January 29-30, 2013 at the Santa Clara Convention Center.

Rogers will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall. Rogers welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.

Rogers has announced that it will be displaying three of their leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Centre (Denver, CO).

Representatives from Rogers Corporation’s (NYSE:ROG) Advanced Circuit Materials Division (ACMD) will be on hand at the upcoming 2011 IEEE International Microwave Symposium (IMS) (www.ims2011.org) to share insights on the optimum use of the company’s high-performance circuit materials, including its RT/duroid® 6035HTC, and RO4360™ laminates. The 2011 IEEE IMS, scheduled for June 7-9, 2011 at the Baltimore Convention Center (Baltimore, MD), ...

Rogers Corporation’s (NYSE:ROG) Advanced Circuit Materials Division (ACMD) opened a new production facility in Asia, one of its largest market regions. Rogers’ new ACMD Suzhou, China manufacturing facility represents a major investment in the modern China Suzhou Innovation Park (http://www.csibi.cn). This ACMD dedicated production facility significantly increases Rogers’ global capacity for its high-performance RO4000® circuit laminates by...

Rogers Corporation announced its new SYRON® 7000 and 7100 high-performance circuit materials, engineered for applications that demand outstanding high-temperature stability.

Rogers Corporation (NYSE: ROG) announced today that it has closed on the transaction to acquire Curamik Electronics GmbH, a manufacturer of power electronic substrate products headquartered in Eschenbach, Germany. As previously announced on January 3, 2011, Rogers signed a definitive agreement on December 31, 2010 to acquire 100% of the stock of Curamik Electronics GmbH for €116 million (subject to post closing audit adjustments).

Rogers Corporation (NYSE: ROG) will be showing off some of its latest materials as well as a free design program at this year’s DesignCon® 2011 exhibition (Santa Clara Convention Center, Santa Clara, CA, February 1-2, 2011). DesignCon (www.designcon.com/2011), the first major electronics industry event of the year, is a key forum for specifiers of PCB materials, semiconductor devices and ICs, modeling tools, and test equipment. The Rogers’ t...

Rogers Advanced Circuits Materials Division (ACM) will be introducing two new laminates to the market at the IEEE Radio & Wireless Week expo at the Renaissance Glendale Hotel & Spa in Glendale, Arizona January 17-18, 2011. Rogers (Booth #2) will be featuring its new XT/duroid™ 8000 series high performance thermoplastic laminate materials along with its new RT/duroid® 6035HTC high thermal conductivity laminates.

On December 31, 2010, Rogers Corporation signed a definitive agreement to acquire 100% of the stock of Curamik Electronics GmbH, a manufacturer of power electronic substrate products headquartered in Eschenbach, Germany, for €116 million (subject to closing adjustments). The acquisition will be financed through a combination of borrowings under existing bank credit facilities and cash and is expected to close this week.

Rogers Corporation (NYSE: ROG) will be highlighting the benefits of its new 6.15 dielectric-constant RO4360® laminate and RO4460® prepreg system at the upcoming Electronics Midwest 2010 exhibition (Donald E. Stephens Convention Center, Rosemont, IL, September 28-30, 2010). In addition, members of Rogers Advanced Circuit Materials (ACM) Division will be on hand in Booth# 7913 to offer suggestions on the optimal use of their high-speed digital Th...

Rogers Corporation (NYSE:ROG) has developed the perfect match for their popular RO4360™ laminate: RO4460™ prepreg. Both materials feature dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high frequency circuits where space is at a premium.

Rogers Corporation (NYSE:ROG) has developed the perfect match for their popular RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high frequency circuits where space is at a premium.

Rogers Corporation and its Advanced Circuit Materials (ACM) Division earned a distinguished DesignCon Paper Award at last month’s DesignCon 2010 Conference and Exhibition in Santa Clara, CA.

Rogers Corporation will present a sampling of its microwave materials solutions at the upcoming SATELLITE 2010 (March 16-18, 2010, at the Gaylord National Convention Center, MD) located minutes from Washington D.C.

Rogers Corporation will showcase three of its advanced materials for microelectronics packaging at this year’s International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010