Analysis
Nordson DAGE’s Senior Applications Engineer to Present at SMART Group BGA and Cleaning Reliability Conference
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference, scheduled to take place October 5-6, 2011 at the Oxfordshire Conference Centre in Thame, Oxfordshire.
Pad Kamran Iqbal is the Senior Applications Engineer for Nordson DAGE, specializing in new application development for bond test equipment platforms and materials testing. Prior to this role, Kamran has worked in the automotive research and development field, and in the electronic design, test and inspection areas, primarily in the defense and aviation industry. Kamran holds a Bachelor’s Degree in Electronic and Electrical Engineering and a Master’s Degree in Wireless Engineering from UK universities, and is experienced in electromechanical engineering.