Negative film photoresists on show
Engineered Materials Systems, Inc. will exhibit its DF-1000 Series Negative Film Photoresists at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City.
The DF-1000 series is available in various thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-1000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (by DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. Additionally, the film is hydrophobic in nature, providing for both chemical and moisture resistance. DF-1000 series films are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and TSV passivation/sealing applications.
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