Innovations for FINEPLACER lambda to be highlighted at Productronica 2011

An innovative software-controlled virtual shutter provides alternating illumination of chip and substrate with a manually adjustable frequency. This approach takes advantage of the operator eye’s slowness of visual processing. Without losing image information as it would be the case with a mechanical shutter, visual alignment with overlay images now looks and feels more naturally and convenient. The optimal light values and shutter parameters can be saved together with every working step.

A new option for the alignment camera allows image shifting in order to expand the visible image of a chip in y-direction. This is useful when chip and substrate have to be aligned under maximum magnification and the chip’s fiducials exceed the field of view.

Optimized positioning table and extra-sensitive vacuum detection.

Various special applications require a Z-shift of the substrate from focal plane to the placement plane after alignment. To maintain accuracy, Finetech has developed an optimized Z-travel guide for the positioning table. Digital micrometer screws provide 1 µm resolution for all axes.
Also the vacuum-based chip detection at the tool, which is needed to trigger motorized placement and bonding processes, could be improved by optimizing the measuring method. Even particularly small, light and delicate chips now can be detected very reliably.

Live demo at Productronica
At Productronica, visitors can experience a FINEPLACER® lambda featuring the latest configuration options. The strengths of the system will be showcased running complex chip array applications with single components being placed with defined distances and then soldered to the substrate simultaneously. By placing dimensioned glass chips, visitors can learn more about the improved optics and superior placement accuracy.

Visit Finetech in Munich at Productronica 2011, booth no. A4-281.