Indium’s VP of Technology to present at SMT Hybrid Packaging
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg.
Dr. Lee’s workshop, DfX for Advanced Soldering Technology, covers the principles of designing for manufacturability (DfM) and reliability (DfR). Participants will learn how to maximize the output of manufacturing yield and reliability when addressing advanced soldering technology. Dr. Lee’s lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
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