Analysis
Semikron - New packaging technology replaces wire bonding
Semikron has developed a revolutionary packaging technology for power semiconductors, which removes the need for bond wires, solders and thermal paste. The new SKiN technology is based on the use of a flexible foil and sintered connections. Current density is doubled to 3 A/cm2 compared with the 1.5 A/ cm2 achievable with standard wire bond technology. Converter volume can therefore be reduced by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.
ThisIn addition to removing the need for wire bonding, the new packaging solution is free of solder thermal paste. Instead, a sinter layer replaces the thermal paste layer and the soldered base plate. Thermal paste is responsible for around 30% of the total thermal resistance in a system. By replacing this, the thermal conductivity between chip and heat sink is improved, resulting in a 30% increase in usable electric current.
SKiN Technology enables a 3 MW wind power converter to be fitted into a single switch cabinet. A 90 kW converter for hybrid and electric vehicles can be 35% smaller than the smallest converter on the market today. For converters in vehicles and wind power units, liquid-cooled systems are used, and the compact and lightweight converters used offer Semikron’s customers an important competitive edge with their reduced thermal impedance and increased power-cycle capability.