Formula E & EMS to develop electrically conductive adhesives

The companies will introduce the FE-106 Low Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules at exhibits W4-510 (Formula E @ Coveme booth) and N1-110 (EMS) at the 8th SNEC Power Expo 2014, scheduled to take place May 20-22, 2014 at the Shanghai New International Expo Center in Shanghai, China.

FE-106 is the first material developed under the collaboration agreement that is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The companies used EBfoil manufactured by Coveme s.p.a. for the back contact sheets in several repeated tests and production runs.

The adhesive is stress absorbing to withstand the rigors of thermal cycling, and features excellent conductive stability to back contact metallizations during damp heat exposure. The FE-106 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material is approximately 60 percent lower cost than standard silver filled adhesives. When linked to Formula E proprietary technology and process, it grants higher performance levels and power output from the high efficiency PV modules compared with any other conductive adhesive.

Company representatives will be available at the show to discuss Formula E photovoltaic solutions at exhibit W4 -510 (Formula E @ Coveme booth) and Engineered Materials Systems’ electrically conductive adhesives at exhibit N1-110.