/> The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring precision, advanced technologies and the highest bonding placement accuracy (down to ± 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging using various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives, and curing.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors, and more. The system handles component sizes from 0.15 to 60 mm and special tools allow object sizes down to 5 micron.