Finetech Announces Two Separate International User Meetings

Finetech will hold the International User Meeting for Micro Assembly in Berlin on September 30, 2010 for users, customers and specialists working in the field of advance packaging.

It is a brilliant opportunity to meet users, customers, prospects, industry representatives and academics for a prolific exchange of experiences. The agenda includes lectures and presentations of the latest equipment and application solutions and a joint evening program.

The second conference day is dedicated to discussing individual topics with Finetech product managers and application engineers.

On October 14, 2010, Finetech will go to Hungary for first international user meeting advanced rework abroad.

Register now and join us for an event that is completely dedicated to all things SMD rework just outside the picturesque city of Budapest.

Meet experts of the fast-growing Eastern-European SMT industry, customers and prospects, Finetech’s rework specialists and many more.

The main focus of the October event will be the introduction to Finetech’s hot air rework approach.

During live machine presentations and hands-on, experienced speakers will introduce you to the Do’s and Don’ts of essential rework steps. Also learn more about the new compact hot air rework station.

During the conference, there will also be plenty of opportunities to discuss future challenges and reproducible solutions for high-end applications such as 01005 and Package-on-Package (PoP).

Registration for both events is completely free of charge and forms must be completed and returned by September 15, 2010.