Penn State Wins Finetech Die Bonder Donation

29th August 2012

Nat Bowers

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Datasheet

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER Pico MA bonder on August 15, 2012. The multi-application system with 5 micron placement accuracy is valued at $100,000. As part of its 20th anniversary celebration this year, Finetech chose to give back to the university R&D segment of its business by donating a bonder for research and education. Nearly 400 entries were received, representing 95 universities.

International Microelectronics and Packaging Society President Voya Markovich visited the Finetech office in New Hampshire to select the winning university in a random drawing. IMAPS also shares a close relationship with academic researchers through its Microelectronic Foundation. This group supports students and research with activities that promote an understanding of how components are made as well as related assembly technologies and materials.

“We are delighted to be chosen for the die bonder donation and look forward to using it in our new lab for research dealing with heterogeneous integration of materials and MEMS packaging applications. I have always wanted a die bonder to complete my packaging lab, but funding was always the challenge,” states Srinivas Tadigadapa, Pennsylvania State University, Professor, College of Engineering - MEMS Nanoscale and Devices Group.

With a wide installed base of systems at many prestigious institutions, FINEPLACER die bonders provide an ideal solution for advanced technology environments utilizing diverse applications. The FINEPLACER Pico MA is an “all-in-one” platform for precise packaging and assembly applications -- such as flip chip, optoelectronics, 3D, wafer level integration, micro-optics assembly, sensor packaging and precise die bonding.