Swiss Quality SMD Assembly Shown At Electronica India

Essemtec's promoted solution consist of a SP150 high accuracy solder paste printer, a PANTERA-XV highly flexible SMD pick and place and a RO300-FC full convection reflow oven. This line is especially designed to meet the requirements of a highly versatile production with many product changeovers and small to medium batch sizes.

The SP150 is a semi-automatic system with integrated stencil cleaning, controlled printing process and digital vision system. This affordable machine can reproducibly print finest structures even in larger series. Due to the space saving front drawer the SP150 fits into every production.

The vision system of the SP150 is easy and save: two digital cameras look through a stencil opening onto the substrate. The printer automatically recognizes if the substrate is misaligned. By integrated position encoders the software can instruct the operator exactly how to correct the alignment. The SP150 continuously controls the result. The print cycle is released only if the alignment is perfect.

The PANTERA–XV SMD placement machine directly addresses prototyping and production runs in mid-sized quantities. The PANTERA-XV is the culmination of two already successful placement machines, the FLX2010 and the CSM7100-V, combining the best from both machines: higher placement accuracy and speed, broader application range, highest reliability and very low maintenance costs, as well as very short changeover times and excellent cost-performance ratio.

The PANTERA–XV placement machine handles the entire SMD range from 0201s to 50 x 50 mm QFPs with a fine pitch of 0.4 mm. Designed for the assembly of complex printed boards and fast changeover, the machine offers a large number of feeder slots (up to 108) in a small footprint of less than 1 sq m. All intelligent tape and stick feeders will be recognized automatically, regardless of the feeder slot being used. This provides for a very fast and error-free changeover process. The tape feeders are motorized and the transport speed is programmable.

Soldering of complex SMD PCBs and new housing technologies require an exact controlled soldering process. The RO300FC is a full convection oven that allows fast and homogeneous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology offers a unique and innovative and efficient way of heating with a vertical hot air stream that evenly heats the complete PCB. Both standard and lead-free pastes can be used.

As an innovative new feature, RO300FC-N2 now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This technologically advanced software offers many of the same features as thermal profilers, but for less than half the price. Also, because the software is within the RO300FC-N2, Essemtec is able to offer users an industry first.

Swiss manufacturer of machines Essemtec is the leader in the branch of flexible production systems for the industry. Essemtec has developed, fabricated, and distributed equipment and machines for all processes of electronics manufacturing — printer, dispenser, pick-and-place and solder systems — since 1991. Manual, semiautomatic and fully automatic systems are available. Transportation and storing systems also belong to the range of products as well as software solutions for the planning, simulation, optimizing and documentation of the fabrication. All systems of Essemtec are optimized on maximum flexibility. Users can adapt from one product to the next as quickly as possible while simultaneously taking advantage of the optimal production capacity.