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Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at Intersolar North America 2011

13th June 2011

Engineered Conductive Materials

ES Admin

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Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, announces that Rich Wells will present “Cost Reduction with High Performance Conductive Adhesives for Cell Interconnects” during the Innovation Exchange at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.

With the escalation of silver prices, the cost of electrically-conductive adhesives (ECAs) for the solar industry has certainly been impacted. ECAs are integral as cell interconnects for thin-film and the emerging back contact cell design. Cost reduction of ECAs is essential to ensuring that emerging solar technology is cost competitive. This presentation will discuss how new ECA technology from ECM provides a lower cost solution without compromising performance.

Rich joined EMS in 1999 and began as the EMS Technical Director. Since then, he has become Chief Technical Officer of both ECM and EMS, while also supporting the EMS-Far East Operations. Rich has several patents for the development of materials used in the inkjet industry, and he currently leads the efforts in developing conductive adhesives and inks for the solar industry. Rich completed his undergraduate work in chemistry at Anderson University and earned a MS in Polymer Science from the University of Akron.