Engineered Conductive Materials
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Engineered Conductive Materials Articles
ECM to Discuss New ECA Technology at MWT Workshop
Engineered Conductive Materials, has today revealed that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.
Keith Margolin Joins Engineered Conductive Materials as Formulation Chemist
Engineered Conductive Materials, LLC has appointed Keith Margolin as Formulation Chemist in its Research and Development (R&D) group. In support of its rapidly expanding business in the photovoltaic market, the company is expanding its R&D group, which is focused on developing conductive interconnect materials for photovoltaic applications.
Engineered Conductive Materials, LLC Introduces Conductive Grid/Busbar Inks for Thin-Film Photovoltaic Applications
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces two next-generation conductive grid inks, CI-1083-L and CI-1081-H, for use in thin-film solar modules. These material formulations have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications.
Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.
Engineered Conductive Materials Introduces Low-Temperature Curing Conductive Adhesive DB-1541-LTC for OPV
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces the DB-1541-LTC Low-Temperature Curing Conductive Adhesive for use in organic solar modules or other temperature-sensitive photovoltaic devices. This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 100°C.
Engineered Conductive Materials Appoints EMJS Tech, Inc. to Represent Its Sol-Ag Line of Conductive Adhesives and Grid Inks in Korea
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, announces that EMJS Tech, Inc. will represent its Sol-Ag line of conductive adhesives and grid inks throughout Korea.
Engineered Conductive Materials Debuts DB-1538-2 Ribbon Attach Conductive Adhesive
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.
Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at Intersolar North America 2011
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, announces that Rich Wells will present “Cost Reduction with High Performance Conductive Adhesives for Cell Interconnects” during the Innovation Exchange at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Engineered Conductive Materials to Exhibit Stringer Attach Adhesives at Intersolar North America 2011
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its DB-1541-LC and DB-1548-LC Series Low-Cost Conductive Stringer Attach Adhesives in the West Hall L3, Stand 9015 at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.