Dry-film negative photoresist suitable for use in MEMS
Engineered Material Systems has introduced the DF-3050 Dry-film Negative Photoresist for use in MEMS and wafer-level packaging applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.
DF-3050 is available in other thickness formats from 5 to 50um, ±5%. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3050 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3050 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.
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