Analysis
congatec Unveils New COM Express Basic Module with ECC Support
congatec AG, a leading manufacturer of embedded computer modules, adds the conga-BE57 to its COM Express product family. Designed for DDR3 ECC SODIMM memory modules and equipped with extremely low power Intel® processors in a BGA package, the conga-BE57 is particularly suitable for mission critical applications.
ECC Depending on the application, the conga-BE57 is based on the Intel® Celeron® U3405 processor (2MB Cache, 1.07 GHz, TDP 18 Watt) or the Intel® Core(tm) i7-610E processor (4MB Cache, 2.53 GHz, TDP 25 Watt). The module uses the Mobile Intel® HM55 Express Chipset, which provides support for up to 8GB (1066 MT/s) Dual Channel DDR3 SODIMM ECC memory. The integrated graphics controller supports the Intel® Flexible Display Interface (FDI) thereby enabling two independent video channels on VGA, LVDS, HDMI, SDVO and DisplayPort interfaces.
Five PCI Express Lanes, eight USB 2.0 ports, three SATA, one EIDE and a Gigabit Ethernet interface allow flexible system expansion at high data bandwidths. A fan controller and LPC bus, as well as Intel® High Definition Audio, round off the complete package.