BTU is staying in the AREA Consortium

“Our involvement in the APL has multiplied our capabilities in advanced SMT processes,” said Rob DiMatteo, Regional Sales Manager for BTU.  “There are a number of process challenges and opportunities today in both SMT and packaging; we aim to be part of the solution,” added DiMatteo.

More than twenty years ago, Universal Instruments’ SMT Laboratory initiated a pre-competitive cooperative research effort with various Fortune 100 companies for the comprehensive development of the assembly processes for Ultra Fine Pitch and Tape Automated Bonded components. The project was organized to defray the high costs and associated technical risks among a large group of principals and to allow the researchers from the member companies an opportunity to cooperate in research projects. This highly successful research collaboration has evolved and adapted to the ever-changing demands of the electronic packaging and assembly industry.  It developed into a series of funded research projects now known as the AREA Consortium.

The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set.