/> Selection of the correct joining process and materials for advanced electronic device packaging (Microelectronic, Semiconductor, PV etc.) is critical for electrical functionality, mechanical integrity and overall reliability.

The Basic Packaging Workshop will provide delegates with an insight into this grounding breaking technology, its business drivers and assembly techniques from the specialists: “IMAPS-UK”, the United Kingdom Chapter of the International Microelectronics & Packaging Society.

Day one is a Technical Seminar providing presentations on various aspects of the technology and day two is a hands-on practical workshop giving introductory training on two selected topic areas – Wire bonding and Epoxy Adhesives.