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AppliedMicro Picks Tensilica's Dataplane Processors for High-Throughput Communications Chip Design
Tensilica,® Inc. today announced that AppliedMicro (Nasdaq:AMCC) has selected Tensilica's Xtensa® LX dataplane processors (DPUs) for an upcoming high-throughput communications chip design project.
We sAppliedMicro's project is typical of high performance dataplane signal processing designs that can take advantage of our customizable dataplane processor (DPU) and specialized I/Os, stated Steve Roddy, Tensilica's vice president of marketing and business development. In the dataplane, our customers often need data throughput and computational performance that can't be achieved using traditional processors. With our unique and patented process of automated customization of dataplane processors, application-specific I/Os can be rapidly added to a processor core to meet any desired I/O bandwidth requirement.