8th Finetech International User Meeting micro assembly in Berlin

Like the year before, the focus will be on trends and challenges in the micro assembly sector. The Finetech team will be supported by high-profile experts from industry and research, adding presentations on current and future technological developments and case studies.
Demanding laser applications, micro optics assembly, MEMS/MOEMS packaging or seminal chip to wafer applications are just some of the topics of practical relevance to be highlighted. In addition, open discussion sessions will give plenty of opportunities for dialog and exchange.
The meeting will be completed by a practical part where the participants will be introduced to the latest FINEPLACER® bonding solutions and have the chance to get a hands-on impression. All visitors are also invited to spend the evening together having dinner and enjoying one of the many cultural attractions Berlin has to offer.
For Friday, September 30, interested visitors can make individual appointments with Finetech experts to get advice on specific projects.