News & Analysis
electronica 2006 Sponsors Elektra's "System on Chip Design Award for Industrial & Automotive Applications"
To recognize the greatest achievement in system-on-chip design in the European electronics industry, electronica will be awarding the "System on Chip Design Award for Industrial & Automotive Applications" on November 15, 2006.
MOSFETs meet Class D audio amplifier needs
A new generation of trench MOSFETs from Zetex Semiconductors has been introduced to provide the high efficiency, cool running and quality audio reproduction demanded by Class D output stages. Rated at 70V, and offered in SOT223 and DPAK packages, these N- and P-channel devices ensure reliable, safe operation in higher power audio applications including flat panel TV and 5.1 surround sound systems. The selection will suit single-ended and bridge...
PXI switch module is capable of routing signals up to 600 V
National Instruments announced the industry’s highest-voltage PXI switch module, which is capable of routing signals up to 600 V. The high-voltage multiplexer adds to the more than 80 existing switch configurations available in the PXI platform from NI. Engineers can use this new switch module with the flexibility of the PXI platform to build automated test systems with stringent voltage, current and bandwidth requirements using one compact, ru...
VCom calibrator reduces manufacturing costs in TFT-LCDs
Replacing one of the last remaining mechanical stages in a TFT-LCD assembly, Intersil’s ISL45041 is a 7-bit, non-volatile programmable Vcom calibrator with I2C interface for setting backplane common voltage in thin film transistor liquid crystal displays (TFT-LCDs). The device is designed to reduce the flicker of an LCD panel by adjusting the Vcom voltage during production, effectively replacing the mechanical potentiometers normally needed to...
Optocouplers in "Stretched" SMT Package Meets Stringent Safety Regulations
Avago Technologies has introduced a series of high-speed optocouplers in Stretched Small Outline (SSO) packages with two new features: they are as much as 50 percent smaller than conventional dual-inline packages while providing up to 8 mm of creepage and clearance to meet stringent IEC, UL and CSA reinforced safety and insulation regulatory requirements. Applications for the SSO6 and SSO8 (6 and 8 pins, respectively) packages include digital log...
Tiny Surface-Mount Diodes for Devices Ranging From RF Tags to TV Systems
Avago Technologies has announced it is now supplying four of its high-performance diode chips in the smallest surface-mount package that it has ever offered. At only 1.2 mm long by 0.8 mm wide and 0.6 mm in height, 12 diodes could fit on a grain of rice. The latest miniaturizations expand the company's offerings to developers of such diverse products as mobile handsets, radio frequency identification (RFID) tags, wireless local area networks, cab...
New Distribution Strategy for Rittal
Rittal has made key changes to its distribution strategy after selecting twenty UK distribution partners - all of which have shown exceptional technical capabilities, dedication in their field and who will be able to provide the full Rittal product range from local sources. They are to be known as Alliance Partners.
WiQuest Licenses Tensilica’s Xtensa Processor for Low-Power Wireless USB Chip Design
Tensilica Inc. today announced that WiQuest Communications, Inc. has deployed the Xtensa configurable processor in WiQuest’s WQST110 ultrawideband (UWB) wireless USB chip design.
Datasound's Comms Platform has Universal Socket Support
The new FlexCom104 communications platform from Datasound Laboratories supports Multitech universal socket devices and can carry up to two universal socket compliant modules.
Low-profile PCB-mounting transducer measures up to 100A
LEM has introduced the LAX 100-NP, a miniaturised PCB-mounting transducer for the measurement of currents up to 100ARMS. This new Closed Loop Hall-effect sensor can be configured, by means of the primary connections on the PCB, to measure currents up to 16.67, 25, 33.33, 50 or 100ARMS. Its design simplifies integration with power modules in drive and inverter designs.