News & Analysis
IP offers seamless integration of USB 2.0 functionality into advanced SoCs from 40nm
Toshiba Electronics Europe’s ASIC & Foundry Business Unit has announced an intellectual property (IP) block that provides an advanced, flexible and future-proofed solution for the rapid integration of USB functionality into system-on-chip (SoC) designs. Delivering physical layer functionality for USB 2.0, the Toshiba USB 2.0 PHY IP provides a silicon-proven interface between the USB Host or Device Controller and the USB system.
Keithley to Explore Challenges of LTE Testing in Free Workshop at EuMW
Keithley Instruments, Inc will be presenting a two-hour workshop entitled “LTE testing – understanding how your LTE radio is performing” on the first day of European Microwave Week (EuMW), which takes place in Rome, Italy, from September 29 to October 1, 2009. Attendance at the workshop is free of charge, but registration is required. For further details and to register, visit http://www.keithley.eu.com/art_resource.php?sid=kquj.2dfmrki.
Rotary joints for smooth rolling rotational antennas
A range of high quality, high reliability rotary joints, essential components in any directional antenna system, is now available in the UK through specialist RF & Microwave distributor, Aspen Electronics. Manufactured in the US by Diamond Antenna & Microwave, the range includes hundreds of designs, from single channel coax and waveguide rotary joints to multi-channel products.
congatec AG gets one million Euros to promote further growth
congatec AG has announced that Technofonds Bayern (The Bavarian Technology Fund) of Bayern Kapital GmbH (Bavaria Capital) intends to increase its holding in the company by injecting a further one million Euros, together with a group of lead investors. Their total share holding will thereby increase to 11.1 %.
NXP and Trusted Logic partner to drive NFC middleware integration
NXP and Trusted Logic today announced a partnership in which Trusted Logic will distribute and market the NFC middleware, which embeds the NXP Reference Implementation. This agreement will accelerate NFC deployment, with a faster time to market and skilled resources to support NFC middleware integration into NFC-enabled wireless devices.
New Package Option for Lattice MachXO PLD Family said to Reduce Cost and Board Area
Lattice has announced the availability of a new 0.8-mm pitch 256-pin Chip-Array BGA (caBGA256) package for its popular MachXO PLD family that provides designers with a broader range of package options for implementing cost-sensitive, board space constrained designs. The Mach XO640, XO1200 and XO2280 devices are now available in the 14 x 14 mm, caBGA256 package with up to 211 user I/O. The new packages provide designers with 10% lower cost and 30%...
Tyco Electronics wins 2008 supplier of the year from Enics AG
Tyco Electronics has received the 2008 Supplier of the Year Award from Enics AG. The award was presented at the recent Enics Fair 09 in Helsinki, Finland in recognition of Tyco Electronics’ exceptional operational performance, as well as the company’s strong account management and commitment to customer satisfaction.
Adeneo Embedded announces Linux Embedded training in Paris using Freescale’s i.MX-ARM Embedded MPUs
Adeneo Embedded announced today a Linux Embedded training course in Paris, France, from September 28th to October 1st, 2009. This event is a unique opportunity for software system designers to develop an application based on Linux Embedded, using Freescale’s i.MX27 applications processor solution. Freescale's i.MX family, based on ARM® core technology, is engineered to offer Smart Speed, low-power consumption with MHz performance to spare and ...
Replacement for Robinson Alarm Logic Units
Omniflex have released a 24 way IEC61508 SIL 1 Alarm Annunciator, which can be used to replace the now obsolete Robinson Alarm logic Units. These Old Robinson ALU units, many of which are in operation but are no longer supported can now be replaced with minimal disruption and cost.
Synopsys and TSMC jointly develop interoperable process design kit and interoperable ecosystem
iPDKsSynopsys has announced that Synopsys and TSMC have entered into a comprehensive multi-year agreement to jointly develop, validate, support and distribute interoperable process design kits (iPDKs) that are optimised for TSMC advanced semiconductor processes including the 65nm, 40nm and 28nm nodes. The agreement is the culmination of a two year collaboration to establish an interoperable PDK ecosystem that can accelerate and broaden designer a...