Indium Corporation to feature products for HIA and SiP at IMAPS Boston

Indium Corporation will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from 3 – 6 October 2022, in Boston.

Indium Corporation’s SiPaste series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent printing performance.

Water-soluble SiPaste 3.2HF has been adopted by OSATs and has been used in more than 5 billion mobile FEM SiP modules. The SiPaste C201HF offers the same printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

Indium Corporation will also feature the first low-residue no-clean, ball-attach flux on the market. NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications.

This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699.

NC-809 exhibits wetting performance and is qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

NC-809 offers:

• High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
• Consistent flux deposition and excellent wetting
• Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
• Compatibility with a wide variety of underfills
• Reduced warpage of package and lower thermal stress due to absence of cleaning step