eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions

Nextreme NEW ASICs provide designers with a unique platform for reducing the time (and development cost) of custom chip designs, compared to traditional cell-based ASICs. Designers are able to implement designs and receive fully tested chips back in a fraction of the time, thus enabling early customer traction and market penetration. In addition to enabling fast market access, eASIC’s patented technology enables device manufacturing to start ahead of design completion. Wafers can be staged and customized late in the manufacturing cycle for unique customer designs enabling OEMs to receive tested ASIC devices in only six weeks after design tape-out.

“eASIC’s devices provided us with an inexpensive vehicle to get to market and ramp up production quickly,” commented Jonas Olsen, Vice President of Marketing at On-Ramp Wireless. “As we target many markets that are still emerging, development cost, development time, and flexibility to innovate and change quickly are critical.”

Built on On-Ramp’s Ultra-Link Processing™ (ULP) technology, the eNode is the first wireless module to provide metro-scale wireless networking in unlicensed ISM-bands. ULP also enables the system to provide a significant increase in network capacity, which substantially lowers network infrastructure and cost.

“On-Ramp’s innovative ULP signal processing technology is in high demand for a wide variety of wireless systems used for control and monitoring,” said Jasbinder Bhoot, Vice President of Marketing, eASIC Corporation. “To meet their customer demand in Smart Grid, industrial sensing and location tracking requires the ability to quickly develop cost effective solutions. eASIC’s Nextreme devices are the ideal choice when time to market and low-cost are paramount.”